EPC2025ENGR

EPC

EPC2025ENGR
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Part No. EPC2025ENGR
Manufacturer EPC
Description TRANS GAN 300V 4A BUMPED DIE
Lead Free Status / RoHS Status Lead free / RoHS Compliant
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Specifications

Data sheet

Vgs(th) (Max) @ Id:2.5V @ 1mA
Vgs (Max):+6V, -4V
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:Die Outline (12-Solder Bar)
Series:eGaN®
Rds On (Max) @ Id, Vgs:150 mOhm @ 3A, 5V
Power Dissipation (Max):-
Packaging:Tray
Package / Case:Die
Other Names:917-EPC2025ENGR
EPC2025ENGRC
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds:194pF @ 240V
Gate Charge (Qg) (Max) @ Vgs:1.85nC @ 5V
FET Type:N-Channel
FET Feature:-
Drive Voltage (Max Rds On, Min Rds On):5V
Drain to Source Voltage (Vdss):300V
Detailed Description:N-Channel 300V 4A (Ta) Surface Mount Die Outline (12-Solder Bar)
Current - Continuous Drain (Id) @ 25°C:4A (Ta)
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