XCZU11EG-2FFVC1760E

Xilinx

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Part No. XCZU11EG-2FFVC1760E
Manufacturer Xilinx
Description FPGA Zynq UltraScale+ Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray
Lead Free Status / RoHS Status Lead free / RoHS Compliant
In stock 75 pcs
Reference Price
(In US Dollars)
10 pcs100 pcs1000 pcs10000 pcs
$7,453.616$6,728.042$6,068.43$5,936.508
Submit a Request For Quotation on quantities greater than those displayed.
Target Price:(USD)
Quantity:
Total:
$7,453.616

Specifications

Data sheet

Supplier Device Package:1760-FCBGA (42.5x42.5)
Speed:533MHz, 600MHz, 1.3GHz
Series:Zynq® UltraScale+™ MPSoC EG
RAM Size:256KB
Primary Attributes:Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Peripherals:DMA, WDT
Packaging:Tray
Package / Case:1760-BBGA, FCBGA
Operating Temperature:0°C ~ 100°C (TJ)
Number of I/O:512
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Flash Size:-
Detailed Description:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5)
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture:MCU, FPGA
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