69-11-42339-T777

Parker Chomerics

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Part No. 69-11-42339-T777
Manufacturer Parker Chomerics
Description THERMAFLOW 28X28MM SOLDER HYBRID
Lead Free Status / RoHS Status Lead free / RoHS Compliant
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Reference Price
(In US Dollars)
1 pcs10 pcs25 pcs50 pcs100 pcs
$1.14$1.083$1.054$1.026$0.969
250 pcs500 pcs1000 pcs5000 pcs 
$0.912$0.855$0.798$0.77 
Submit a Request For Quotation on quantities greater than those displayed.
Target Price:(USD)
Quantity:
Total:
$1.14

Specifications

Data sheet

Usage:-
Type:Gap Filler Pad, Sheet
Thickness:0.0045" (0.115mm)
Thermal Resistivity:-
Thermal Conductivity:-
Shape:Square
Series:THERMFLOW® T777
Outline:28.00mm x 28.00mm
Other Names:1944-1285
69-11-42339-T777-DK
Moisture Sensitivity Level (MSL):Not Applicable
Material:Polymer Solder Hybrid
Manufacturer Standard Lead Time:4 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Thermal Pad Gray 28.00mm x 28.00mm Square Tacky - Both Sides
Color:Gray
Backing, Carrier:-
Adhesive:Tacky - Both Sides
Email:info@cjjhk.com

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